1 總則······11

2 術語······12

3 微組裝基本工藝······14

3.1 一般規定······14

3.2 環氧貼裝······14

3,3 再流焊······15

3.4 共晶焊······16

3.5 引線鍵合······17

3.6 倒裝焊······18

3,7 釬焊······19

3.8 平行縫焊······21

3.9 激光焊······23

3.10 涂覆······24

3.11 真空烘焙······25

3.12 清洗······25

3.13 測試······27

4 工藝設備配置······28

4.1 一般規定······28

4.2 環氧貼裝工藝設備······28

4.3 再流焊工藝設備······29

4.4 共晶焊工藝設備······29

4.5 引線鍵合工藝設備······30

4.6 倒裝焊工藝設備······31

4.7 釬焊工藝設備······31

4,8 平行縫焊工藝設備······32

4.9 激光焊工藝設備······33

4,10 涂覆工藝設備······33

4.11 真空烘焙工藝設備······33

4.12 清洗工藝設備······34

4.13 測試設設備······34

5 工藝設計······36

5,1 總體規劃······36

5,2 工藝區劃······36

5.3 工藝設備布置······37

6 廠房設施及環境······38

6.l —般規定······38

6.2 廠房土建······38

6.3 消防給水及滅火設施······39

6.4 供配電系統······39

6.5 照明······39

6.6 空氣凈化系統······40

6.7 信息與安全保護······40

6,8 壓縮空氣系統······41

6,9 純水系統······41

6.10 大宗氣體系統······41

附錄A 微組裝基本工藝流程······43

本規范用詞說明······45

引用標準名錄······46

附:條文說明······47

1 總則······51

3 微組裝基本工藝······53

3.1 一般規定······53

3.2 環氧貼裝······54

3.4 共晶焊······56

3.5 引線鍵合······56

3.6 倒裝焊······59

3.7 釬焊······60

3.8 平行縫焊······61

3.9 激光焊······62

3.四涂覆······62

3.11 真空烘熔······63

3.12 清洗······63

3.13 測試······64

4 工藝設備配置······65

4.1 一般規定······65

4.2 環氧貼裝工藝設備······65

4.4 共晶焊工藝設備······65

4.5 引線鍵合工藝設備······65

4.6 倒裝焊工藝設備······66

4.13 測試設備······66

5 工藝設計······67

5.1 總體規劃······67

5.2 工藝區劃······67

5.3 工藝設備布置······68

6 廠房設施及環境······69

6.2 廠房土建······69

6.3 消防給水及滅火設施······69

6.6 空氣凈化系統······70

6.7 信息與安全保護······70

6.10 大宗氣體系統······70