GB51333-2018······1

1 總則······12

2 術語······13

3 總體設計······14

3.1 一般規定······14

3.2 廠房區劃······14

3.3 設備布置······15

4 基本工藝······16

4.1 一般規定······16

4.2 陶瓷基板預處理······16

4.3 厚膜漿料貯存······16

4.4 印刷網版制作······17

4.5 絲網印刷······18

4.6 通孔金屬化······18

4.7 燒結······19

4.8 激光調阻······20

4.9 鍍涂······21

4.10 裂片······22

4.11 熟切······22

4.12 測試······23

5 工藝設備配置······25

5.1 一般規定······25

5.2 陶瓷基板預處理工藝設備······25

5.3 厚膜漿料貯存工藝設備······25

5.4 印刷網版制作工藝設備······26

5.5 絲網印刷工藝設備······26

5.6 通孔金屬化工藝設備······26

5.7 燒結工藝設備······27

5.8 激光陰阻工藝設備······27

5.9 鍍涂工藝設備······28

5.10 裂片工藝設備······28

5.11 熟切工藝設備······28

5.12 測試設備······29

6 建筑與結構······31

6.1 建筑······31

6.2 結構······32

7 公用設施及動力······33

7.1 空氣凈化系統······33

7.2 給水排水······34

7.3 冷熱源······36

7.4 氣體動力······36

7.5 通風及防排煙系統······38

8 電氣設計······40

8.1 供電······40

8.2 照明、配電和自動控制······41

8.3 通信、信息······42

8.4 接地······42

9 環境保護、節能與消防······43

9.1 環境保護······43

9.2 節能······43

9.3 消防······44

附錄A 厚膜陶瓷基板生產基本工藝流程······45

本標準用詞說明······46

引用標準名錄······47

附:條文說明······48

1 總則······52

3 總體設計······54

3.1 一般規定······54

4 基本工藝······55

4.1 一般規定······55

4.2 陶瓷基板預處理······55

4.3 厚膜漿料貯存······55

4.4 印刷網版制作······55

4.5 絲網印刷······56

4.6 通孔金屬化······56

4.7 燒結······57

4.8 激光調阻······58

4.9 鍍涂······58

4.10 裂片······58

4.11 熟切······59

4.12 測試······59

5 工藝設備配置······60

5.1 一般規定······60

5.5 絲網印刷工藝設備······60

5.8 激光調阻工藝設備······60

5.11 熟切工藝設備······60

5.12 測試設備······60

6 建筑與結構······61

6.1 建筑······61

6.2 結構······62

7 公用設施及動力······63

7.1 空氣凈化系統······63

7.2 給水排水······63

7.3 冷熱源······65

7.4 氣體動力······66

7.5 通風及防排煙系統······67

8 電氣設計······68

8.1 供電······68

8.2 照明、配電和自動控制······68

8.3 通信、信息······69

9 環境保護、節能與消防······71

9.1 環境保護······71

9.2 節能······71